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This week, seven insurance stocks are improving their overall rating on Portfolio Grader. Each of these rates an “A” (“strong buy”) or “B” overall (“buy”).
Hot Semiconductor Stocks To Own Right Now: IEC Electronics Corp (IEC)
IEC Electronics Corp. (IEC) is a provider of electronic contract manufacturing services (EMS) to advanced technology companies. The Company specializes in the custom manufacture of circuit cards and system-level assemblies; an array of cable and wire harness assemblies, and precision sheet metal components. The Company utilizes automated circuit card assembly equipment together with a manufacturing stress testing methods. On December 17, 2010, IEC acquired Southern California Braiding, Inc. Its wholly owned subsidiaries include IEC Electronics Wire and Cable, Inc. (Wire and Cable), IEC Electronics Corp.-Albuquerque (Albuquerque) and Southern California Braiding, Inc. (SCB).
The Company manufactures a range of assemblies that are incorporated into many different products, such as military and defense systems, transportation products, wireless communication systems, and medical systems and instruments. The Company supports multiple divisions and product lines for many of its customers and frequently manufactures successive generations of products.
The Company competes with Flextronics International LTD., Benchmark Electronics, Inc. and Plexus Corp.
Hot Semiconductor Stocks To Own Right Now: Micron Technology Inc.(MU)
Micron Technology, Inc., together with its subsidiaries, engages in the manufacture and marketing of semiconductor devices worldwide. Its products include dynamic random access memory (DRAM) products that provide data storage and retrieval, which include DDR2 and DDR3; and other specialty DRAM memory products, including DDR, SDRAM, DDR and DDR2 mobile low power DRAM, pseudo-static RAM, and reduced latency DRAM. The company also offers NAND flash memory products, which are electrically re-writeable and non-volatile semiconductor devices that retain content when power is turned off. In addition, it provides NOR flash memory products that are electrically re-writeable and non-volatile semiconductor memory devices; phase change memory products; and image sensor products. Micron Technology?s products are used in a range of electronic applications, including personal computers, workstations, network servers, mobile phones, flash memory cards, USB storage devices, digital still c ameras, MP3/4 players, and in automotive applications. It sells its products to original equipment manufacturers and retailers through internal sales force, independent sales representatives, and distributors, as well as through a Web-based customer direct sales channel. The company was founded in 1978 and is headquartered in Boise, Idaho.
Advisors' Opinion: - [By Rex Crum]
Pandora Media Inc. rose (P) 3% to close at $32.44 a share; Western Digital Corp. (WDC) ended the day up by 3.3% at $85.65, Micron Technology Inc. (MU) rose 5% to $21.73 a share, and IBM Corp. (IBM) shares added almost 2% to end the day at $189.71.
Advanced Semiconductor Engineering, Inc. is principally engaged in the manufacture, assembly, processing, testing and distribution of integrated circuits (ICs). The Company provides semiconductor packaging and testing services, including plastic leaded chip carriers (PLCCs), quad flat packages (QFPs) and flip chip packaging technology, among others, which are applied in the manufacture of household electrical appliances, communication devices, automobile components, personal computers, set top boxes, servers, memory integrated circuits (ICs), mobile phones, digital cameras, game consoles, projectors, high definition (HD) televisions, wireless communication network products and power management ICs, among others. The Company operates its businesses primarily in Taiwan, Europe and the Americas. In August 2010, the Company acquired a 100% interest in EEMS Test Singapore.
The Company is focused on packaging and testing logic semiconductors. The Company offers its customers turnkey services, which consist of packaging, testing and direct shipment of semiconductors to end users designated by its customers. The Company�� global base of over 200 customers includes semiconductor companies across a range of end use applications, including Altera Corporation, ATI Technologies, Inc., Broadcom Corporation, Cambridge Silicon Radio Limited and Microsoft Corporation. During the year ended December 31, 2008, the Company�� packaging revenues accounted for 77.7% of its net revenues and its testing revenues accounted for 20.1% of its net revenues.
Packaging Services
The Company offers a range of package types to meet the requirements of its customers, with a focus on packaging solutions. Within its portfolio of package types, the Company focuses on the packaging of semiconductors. These include advanced leadframe-based package types, such as quad flat package, thin quad flat package, bump chip carrier and quad flat no-lead package, and package types based on substrates, such a! s flip-chip ball grid array (BGA) and other BGA types, as well as other packages, such as wafer-bumping products. Leadframe-based packages are packaged by connecting the die, using wire bonders, to the leadframe with gold wire. The Company�� leadframe-based packages include quad flat package (QFP)/ thin quad flat package (TQFP), quad flat no-lead package (QFN)/microchip carrier (MCC), advanced quad flat no-lead package (AQFN), bump chip carrier (BCC), small outline plastic package (SOP)/thin small outline plastic package (TSOP), small outline plastic j-bend package (SOJ), plastic leaded chip carrier (PLCC) and plastic dual in-line package (PDIP). Substrate-based packages employ the BGA design, which utilizes a substrate rather than a leadframe. It also assembles system-in-a-package products, which involve the integration of more than one chip into the same package. The Company�� substrate-based packages include Plastic BGA, Cavity Down BGA, Stacked-Die BGA, Flip-Chip BGA and land grid array (LGA).
The Company�� wafer-level packaging products include wafer level chip scale package (aCSP) and advanced wafer level package (aWLP). The Company offers module assembly services, which combine one or more packaged semiconductors with other components in an integrated module to enable functionality, typically using surface mount technology (SMT) machines and other machinery and equipment for system-level assembly. End use applications for modules include cellular phones, personal digital assistant (PDAs), wireless local area network (LAN) applications, bluetooth applications, camera modules, automotive applications and toys.
The Company provides module assembly services primarily at its facilities in Korea for radio frequency and power amplifier modules used in wireless communications and automotive applications. Interconnect materials connect the input/output on the semiconductor dies to the printed circuit board. Interconnect materials include substrate, which is a multi-layer m! iniature ! printed circuit board. The Company produces substrates for use in its packaging operations.
Testing Services
The Company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, final testing of logic/mixed-signal/radio frequency (RF) and memory semiconductors and other test-related services. The Company provides front-end engineering testing services, including customized software development, electrical design validation, and reliability and failure analysis. The Company provides final testing services for a variety of memory products, such as static random access memory (SRAM), dynamic random access memory (DRAM), single-bit erasable programmable read-only memory semiconductors and flash memory semiconductors.
The Company provides a range of additional test-related services, including burn-in testing, module sip testing, dry pack, tape and reel, and electric interface board and mechanical test tool design. The Company offers drop shipment services for shipment of semiconductors directly to end users designated by its customers.
Advisors' Opinion: Hot Semiconductor Stocks To Own Right Now: Sunedison Inc (SUNE.N)
SunEdison Inc, formerly MEMC Electronic Materials, Inc., incorporated on October 1, 1984, is engaged in the development, manufacture and sale of silicon wafers. The Company is a developer and seller of photovoltaic energy solutions. Through Solar Materials and Solar Energy (SunEdison), it is a developer of solar energy projects. The Company operates in two segments: semiconductor materials and solar energy. The Company�� Solar Energy segment includes the operations of its old Solar Materials segment, as well as its SunEdison business. In the Semiconductor Materials, the Company offers wafers with a variety of features. The Company�� wafers vary in size, surface features, composition, purity levels, crystal properties and electrical properties.
Semiconductor Materials
The Company�� monocrystalline wafers for use in semiconductor applications range in size from 100 millimeter to 300 millimeter and are round in shape for semiconductor cust omers because of the nature of their processing equipment. Its wafers are used as the starting material for the manufacture of various types of semiconductor devices, including microprocessor, memory, logic and power devices. In turn, these semiconductor devices are used in computers, cellular phones and other mobile electronic devices, automobiles and other consumer and industrial products. Its monocrystalline wafers for semiconductor applications include four general categories of wafers: prime, epitaxial, test/monitor and silicon-on-insulator (SOI) wafers.
The Company�� prime wafer is a polished, pure wafer with an ultraflat and ultraclean surface. The Company�� epitaxial (epi), wafers consist of a thin silicon layer grown on the polished surface of the wafer. Typically, the epitaxial layer has different electrical properties from the underlying wafer. This provides customers with isolation between circuit elements than a polished wafer. Its AEGIS product is des igned for certain specialized applications requiring high ! re! sistivity epitaxial wafers and its MDZ product feature. The AEGIS wafer includes a thin epitaxial layer grown on a standard starting wafer. The AEGIS wafer�� thin epitaxial layer eliminates harmful defects on the surface of the wafer, thereby allowing device manufacturers to increase yields. The Company supplies test/monitor wafers to its customers for use in testing semiconductor fabrication lines and processes. An SOI wafer is a different starting material for the chip making process.
Solar Energy
The Company�� Solar Energy segment provides solar energy services that integrate the design, installation, financing, monitoring, operations and maintenance portions of the downstream solar market to provide a solar energy service to its customers. As of December 31, 2012, SunEdison interconnected over 675 solar power systems representing 989 megawatt of solar energy generating capacity. As of December 31, 2012, SunEdison had 73 megawatt of projects under construction and 2.6 gigawatts in pipeline. In support of its downstream solar business, its Solar Energy segment manufactures polysilicon, silicon wafers and solar modules. Additionally, its Solar Energy segment will sell solar modules to third parties in the event the opportunity aligns with itsinternal needs. It provides its downstream customers with a way to purchase renewable energy by delivering solar power under long-term power purchase arrangements with customers or feed-in tariff arrangements with government entities and utilities. Its SunEdison business is dependent upon government subsidies, including United States federal incentive tax credits, state-sponsored energy credits and foreign feed-in tariffs. The Company�� solar wafers are used as the starting material for crystalline solar cells.
The Company competes with Shin-Etsu Handotai, SUMCO, Siltronic and LG Siltron, SunPower Corporation, First Solar, Inc., Enerparc, Sharp Corporation (Recu rrent Energy), Phoenix Solar, BELECTRIC, JUWI Solar Gmb! h, an! d ! Solar C! ity.
Hot Semiconductor Stocks To Own Right Now: Intermolecular Inc (IMI)
Intermolecular, Inc. (Intermolecular), incorporated on June 16, 2004, is engaged in research and development and time-to-market for the semiconductor and clean-energy industries. The Company, through paid collaborative development programs (CDPs) with its customers, develops technology and intellectual property (IP) for its customers focused on advanced materials, processes, integration and device architectures. The Company provides its customers with technology through various fee arrangements and grants them rights to associated IP, primarily through royalty-bearing licenses. Through paid CDPs and its own development, the Company has established a portfolio of greater than 1,000 patents and patent applications. Its approach is broadly applicable to high-volume integrated device markets, which include the markets for semiconductors, flat glass coatings and glass-based devices, solar cells, light-emitting diodes (LEDs), flat-panel displays, advanced batteries and other energy efficiency applications.
As of December 31, 2012, the Company targets large, high-volume semiconductor and high-growth emerging clean energy markets, including DRAM, non-volatile memory (including flash memory and embedded memory), complex logic, flat glass coatings and glass-based devices, solar cells, LEDs and other energy efficiency applications. The Company�� customers include ATMI, Inc. (ATMI), Elpida Memory, Inc. (Elpida), First Solar. Inc. (First), GLOBALFOUNDRIES Singapore Pte. Ltd (GLOBALFOUNDRIES), Guardian Industries Corp. (Guardian), SanDisk Corporation (SanDisk), Taiwan Semiconductor Manufacturing Company (TSMC) and Toshiba Corporation (Toshiba). For the year ended December 31, 2012, the Company has received the majority of its revenue from customers in DRAM, flash memory, complex logic and energy-efficient applications in flat glass. The elements in HPC platform include Tempus HPC processing, automated characterization, and informatics and analysis software. Tempus HPC processing are used to process ! different experiments consisting of combinations of materials, processing parameters, sequencing and device structures. Automated characterization systems are used to characterize the substrates processed by its Tempus HPC processing tools. Informatics and analysis software are used to automate experiment generation, characterization, data analysis and reporting.
The Company�� HPC platform consists of its Tempus HPC processing tools, automated characterization and informatics and analysis software. The Company�� platform is purpose-built for Research and Development (R and D) using combinatorial process systems. Combinatorial processing is a methodology for discovery and development that employs parallel and other high-throughput experimentation, which allows R and D experimentation to be performed at speeds up to 100 times faster than traditional methods. The Company�� processing tools allows performing up to 192 experiments on a single substrate.
Advisors' Opinion: - [By Lisa Levin]
Intermolecular (NASDAQ: IMI) shares touched a new 52-week low of $4.84. Intermolecular shares have dropped 45.09% over the past 52 weeks, while the S&P 500 index has gained 26.39% in the same period.
- [By Sofia Horta e Costa]
ARM Holdings Plc (ARM) lost 2.6 percent, leading European technology companies lower before it publishes half-year results next week. IMI Plc (IMI) gained 2 percent as Citigroup Inc. listed the engineering company among its most preferred stocks.
Hot Semiconductor Stocks To Own Right Now: Intermolecular Inc (IMI.O)
Intermolecular, Inc. (Intermolecular), incorporated on June 16, 2004, is engaged in research and development and time-to-market for the semiconductor and clean-energy industries. The Company, through paid collaborative development programs (CDPs) with its customers, develops technology and intellectual property (IP) for its customers focused on advanced materials, processes, integration and device architectures. The Company provides its customers with technology through various fee arrangements and grants them rights to associated IP, primarily through royalty-bearing licenses. Through paid CDPs and its own development, the Company has established a portfolio of greater than 1,000 patents and patent applications. Its approach is broadly applicable to high-volume integrated device markets, which include the markets for semiconductors, flat glass coatings and glass-based devices, solar cells, light-emitting diodes (LEDs), flat-panel displays, advanced batteries and other energy efficiency applications.
As of December 31, 2012, the Company targets large, high-volume semiconductor and high-growth emerging clean energy markets, including DRAM, non-volatile memory (including flash memory and embedded memory), complex logic, flat glass coatings and glass-based devices, solar cells, LEDs and other energy efficiency applications. The Company�� customers include ATMI, Inc. (ATMI), Elpida Memory, Inc. (Elpida), First Solar. Inc. (First), GLOBALFOUNDRIES Singapore Pte. Ltd (GLOBALFOUNDRIES), Guardian Industries Corp. (Guardian), SanDisk Corporation (SanDisk), Taiwan Semiconductor Manufacturing Company (TSMC) and Toshiba Corporation (Toshiba). For the year ended December 31, 2012, the Company has received the majority of its revenue from customers in DRAM, flash memory, complex logic and energy-efficient applications in flat glass. The elements in HPC platform include Tempus HPC processing, automated characterization, and informatics an d analysis software. Tempus HPC processing are used to proc! e! ss different experiments consisting of combinations of materials, processing parameters, sequencing and device structures. Automated characterization systems are used to characterize the substrates processed by its Tempus HPC processing tools. Informatics and analysis software are used to automate experiment generation, characterization, data analysis and reporting.
The Company�� HPC platform consists of its Tempus HPC processing tools, automated characterization and informatics and analysis software. The Company�� platform is purpose-built for Research and Development (R and D) using combinatorial process systems. Combinatorial processing is a methodology for discovery and development that employs parallel and other high-throughput experimentation, which allows R and D experimentation to be performed at speeds up to 100 times faster than traditional methods. The Company�� processing tools allows performing up to 192 experiments on a single substrate.
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Hot Semiconductor Stocks To Own Right Now: Texas Instruments Incorporated(TXN)
Texas Instruments Incorporated engages in the design and sale of semiconductors to electronics designers and manufacturers worldwide. The company?s Analog segment offers high-performance analog products comprising standard analog semiconductors, such as amplifiers, data converters, and interface semiconductors; high-volume analog and logic products; and power management semiconductors and line-powered systems. Its Embedded Processing segment includes DSPs that perform mathematical computations to process and enhance digital data; and microcontrollers, which are designed to control a set of specific tasks for electronic equipment. The company?s Wireless segment designs, manufactures, and sells application processors and connectivity products. Its Other segment offers smaller semiconductor products, which include DLP products that are primarily used in projectors to create high-definition images; and application-specific integrated circuits. This segment also provides handhe ld graphing and scientific calculators, as well as licenses technologies to other electronic companies. The company serves the communications, computing, industrial, consumer electronics, automotive, and education sectors. Texas Instruments Incorporated sells its products through a direct sales force, distributors, and third-party sales representatives. It has collaboration agreements with PLX Technology Inc.; Neonode, Inc.; and Ubiquisys Ltd. The company was founded in 1938 and is headquartered in Dallas, Texas.
Advisors' Opinion: - [By Monica Gerson]
Texas Instruments (NASDAQ: TXN) is projected to report its Q3 earnings at $0.53 per share on revenue of $3.23 billion. TI shares gained 4.04% to close at $10.30 on Friday.
- [By Dan Caplinger]
Next Monday, Texas Instruments (NASDAQ: TXN ) will release its latest quarterly results. The key to making smart investment decisions on stocks reporting earnings is to anticipate how they'll do before they announce results, leaving you fully prepared to respond quickly to whatever inevitable surprises arise.
- [By Diane Alter]
Dividend Stocks That Increased Payout in September
Accenture plc (NYSE: ACN) announced a 14.8%, or $0.12 per share, increase to its semiannual dividend. The management consulting firm will now pay a semiannual dividend of $0.93. Shares yield 2.53%. Agruim Inc. (NYSE: AGU) boosted its dividend by $1.00 per share to a total dividend of $3.00 on an annualized basis. Shares of the global retailer of agricultural products now sprout a 3.54% yield. Air Industries Group Inc. (NYSE: AIRI) doubled its dividend to $0.125 per share. The maker of airplane and helicopter parts now floats a lofty yield of 6.6%. Alexandria Real Estate Equities Inc. (NYSE: ARE) upped its dividend 4.6% to $0.68 per quarter for a yield of 4.21%. Banner Corp. (Nasdaq: BANR) boosted its quarterly dividend 25% to $0.15 per share. The parent company of Banner and Islander Bank serves the Pacific Northwest region. Brady Corp. (NYSE: BRC) lifted its quarterly dividend 2.6% to $0.78 per share. It was the 28th straight dividend increase from the identification solutions company. Shares yield 2.57%. Campbell Soup Co. (NSE: CPB) raised its quarterly dividend to $0.31 per share, up from $0.29. The company last raised its dividend in November 2010. Shares yield a hearty 3.06%. CLARCOR Inc. (NYSE: CLC) raised its quarterly dividend 26% to $0.17 per share. It's the largest percentage increase from the Tennessee-based diversified marketer of mobile filtration and packaging products in the last 20 years, and it continues the company's consecutive streak of increasing dividends for the last 30 years. Franklin Resources Inc. (NYSE: BEN) boosted its quarterly dividend 2.6% to $0.10 per share. Frisch's Restaurants Inc. (NYSE: FRS) increased its quarterly dividend 12.5% to $0.18. Shares yield 3.10% The Goodyear Tire & Rubber Company (NYSE: GT), in a move that suggests good times are ahead, reinstated its dividend at $0.05 per share. Good
Hot Semiconductor Stocks To Own Right Now: China Electronics Corporation Holdings Co Ltd (85)
China Electronics Corporation Holdings Company Limited is an investment holding company. The Company, through its subsidiaries, is engaged in design, research and development and sale of integrated circuits. The Company�� integrated circuits design business consists of the design of integrated circuits chips and the development of application system. Its products are used in smart cards, such as identity cards, social security cards, telecommunications cards and electric cards. Its products are also applied in wireless local area networks (WLAN). During the year ended December 31, 2011, the Company obtained 17 new patents, and registered another 16 computer software copyrights and 11 integrated circuits layout designs. Its subsidiaries include CEC Integrated Circuit (Beijing) Co., Ltd, CEC Huada Electronic Design Co., Ltd and others.
Hot Semiconductor Stocks To Own Right Now: Taiwan Semiconductor Manufacturing Co Ltd (TSM)
Taiwan Semiconductor Manufacturing Co., Ltd. is a Taiwan-based company principally engaged in the research, development, manufacture and distribution of integrated circuit (IC) related products. The Company operates its businesses through wafer manufacture, mask production, wafer testing and packaging components. The Company also involves in the provision of production management, customer services and design services. Its products and services are applied in the manufacture of personal computers and peripheral products, information related products, wire and wireless communication systems, automobile and industrial equipment, as well as consumer electronic products, such as digital disk players, digital televisions (TVs), game consoles, digital cameras, among others. Its customers include Altera, AMD, Broadcom, Marvell, NVIDIA, Qualcomm, Analog Devices, Freescale, NXP and Texas Instruments, among others. In July 2010, Taiwan Semiconductor Manufacturing Co. acquired mechanical and engineering equipment from ASML HONG KONG LTD. In September 2010, the Company acquired a set of equipments from ASML HONG KONG LTD. In December 2010, the Company acquired a set of equipment from TOKYO ELECTRON LTD., KLA-TENCOR CORP. and NOVELLUS SYSTEMS INTERNATIONAL,B.V. In January 2011, the Company announced that it had acquired a set of equipment from KLA-TENCOR CORP., a set of equipment and facility, and another set of equipment from VARIAN SEMI. EQUIP. ASSOCIATES GmbH. In March 2011, the Company acquired a set of equipments from Rudolph Technologies, Inc.In March 2011, the Company acquired a set of equipments from Rudolph Technologies, Inc. In May 2011, it acquired a set of equipments form APPLIED MATERIALS SOUTH EAST ASIA PACIFIC LTD., Hamatech APE Gmbh and CO. KG, TOKYO ELECTRON LTD., DAINIPPON SCREEN MFG. CO., LTD., and VARIAN SEMI. EQUIP. ASSOCIATES GMBH.
TSMC's customers include semiconductor companies, ranging from fabless semiconductor and systems companies, such as Advanced Micro Devices, In! c., Altera Corporation, Broadcom Corporation, Marvell Semiconductor Inc., MediaTek Inc., nVidia Corporation and Qualcomm Incorporated, to integrated device manufacturers, such as LSI Corporation, STMicroelectronics and Texas Instruments Inc. Fabless semiconductor and system companies accounted for approximately 80%, and integrated device manufacturers accounted for approximately 20% of its net sales as of December 31, 2009.
The Company manufactures semiconductors using CMOS and BiCMOS processes. The BiCMOS process combines the speed of the bipolar circuitry and the power consumption and density of the CMOS circuitry. It uses the CMOS process to manufacture logic semiconductors, memory semiconductors, including static random access memory (SRAM), flash memory, mixed-signal/ radio frequency (RF) semiconductors, which combine analog and digital circuitry in a single semiconductor, micro-electro-mechanical-system (MEMS), which combines micrometer featured mechanical parts, analog and digital circuitry in a single semiconductor, and embedded memory semiconductors, which combine logic and memory in a single semiconductor. The BiCMOS process is used to make high-end mixed-signal and other types of semiconductors.
Advisors' Opinion: - [By Anders Bylund]
Rumor has it that the two frenemies will put some distance between them. Taiwanese tech publication DigiTimes has long suggested that Apple's core chips might find a new home in massive chip foundry Taiwan Semiconductor Manufacturing (NYSE: TSM ) -- and now the publications claims that it's a done deal.
- [By Evan Niu, CFA]
The Korea Times is reporting that�Apple� (NASDAQ: AAPL ) has cut Samsung out of producing its next-generation A7 chip. The Mac maker continues to diversify its component supplier base away from Samsung. Apple has already begun moving display sourcing to�LG Display� (NYSE: LPL ) . The A7 business is reportedly going to�Taiwan Semiconductor Manufacturing� (NYSE: TSM ) and its 20-nanometer process. The transition could hurt Samsung, since it would be left with excess unused. Samsung has supposedly been trying to grow its business with�NVIDIA� (NASDAQ: NVDA ) to mitigate the risk of losing some Apple business.
Hot Semiconductor Stocks To Own Right Now: Advantest Corp (ATE)
Advantest Corporation, incorporated in December 1954, is a part of Advantest group. The Company operates in three segments: semiconductor and component test system segment; mechatronics system segment, focusing on peripheral devices including test handlers and device interfaces, and services, support and others segment. The semiconductor and component test system segment provides customers with test system products for the semiconductor industry and the electronic component industry. The mechatronics system segment focuses on peripheral devices to the semiconductor and component test systems. The services, support and others segment consists of comprehensive customer solutions provided in connection with the semiconductor and component test system and mechatronics system segments, support services and an equipment lease business.
Semiconductor and Component Test Systems Segment
Semiconductor and component test systems are used during the semiconductor and electronic component manufacturing process to confirm that a semiconductor functions properly. Semiconductor and component test systems consist of test systems for memory semiconductors and test systems for non memory semiconductors. Advantest�� test systems for memory semiconductors are test systems designed to test high-speed/high performance dynamic random access memory (DRAM) semiconductors used in equipment such as personal computers and servers, as well as flash memory semiconductors used in digital consumer products.
Test systems for memory semiconductors consist of a mainframe and one or more test heads. During testing, a device interface is attached to the test head. During the front-end testing process, wafers are loaded by a prober and are connected to the test system for memory semiconductors through the device interface. Electric signals between the die and the test systems for memory semiconductors are transmitted through probe pins located in the device interface and tested. After front-end te! sting is completed, the wafer is diced into separate dies and properly functioning dies are packaged. During back-end testing, test handlers are used to load these packaged devices onto the test heads, and electric signals are transmitted between the devices and the test heads via the device interface and tested. The test results are analyzed by the test systems for memory semiconductors��hardware circuits and software programs. Customized software programs for each semiconductor are required to analyze the semiconductor tests and test data.
Advantest�� main product lines of test systems for memory semiconductors are the T5500 series, the T5300 series and the T5700 series. The T5593 is a test system targeted at the market for high speed memory semiconductors, such as DDR2- Synchronous Dynamic Random Access Memory (SDRAM) and Synchronous Graphics Random Access Memory (SGRAM). The T5383 is a multi-functional test system for memory semiconductors that reduces testing costs for semiconductor manufacturers. Advantest�� main line of test systems for non memory semiconductors relates to test systems for SoC semiconductors, test systems for liquid crystal display (LCD) driver integrated circuits and test systems for semiconductors used in car electronics. The T6577 test systems for SoC semiconductors in the T6500 series were primarily developed to test micro controller unit (MCU) and SoC semiconductors that control digital consumer products at the production lines. The T6300 series are test systems for LCD driver integrated circuits used with high-definition LCD displays. The T7721, T7722 and T7723 are test systems for non memory semiconductors for mixed signal integrated circuits. The T8571A is a test system for non memory semiconductors that is primarily used to evaluate and analyze CCDs which are image sensors.
Mechatronics System Segment
The Main products in the Mechatronics System Segment are test handlers which handle semiconductor devices and automate the te! sting, an! d device interfaces which are the interfaces with devices being tested. Test handlers are used with semiconductor and component test systems to handle, condition temperature, contact and sort semiconductors and other electronic components during the back-end testing of the semiconductor manufacturing process. Advantest�� test handlers are sold primarily in conjunction with the sale of its semiconductor and component test systems. The M6242 test handler for test systems for memory semiconductors, including DDR-3SDRAM, can handle up to 512 semiconductors at a time. Advantest�� test handlers for non memory semiconductors, including SoC semiconductors, are the M4841, the M4741A and the M4742A, among others.
Advantest develops and manufactures device interfaces for semiconductor and component test systems and supplies device interfaces, such as high performance and high density connectors, socket boards and sockets. For test systems for memory semiconductors, Advantest provides motherboards capable of handling a maximum of 512 semiconductors at a time. For test systems for non memory semiconductors, Advantest provides motherboards that are compatible with a maximum of 3,072 signals. Advantest also provides motherboards designed for use in front-end testing. Advantest provides custom manufacturing of socket boards and performance boards for each device under test in accordance with customers��specifications.
Advantest provides sockets for test systems for memory semiconductors. Advantest provides low-inductance (0.4nH) sockets and fine pitch (0.4mm) sockets for semiconductors that are becoming more high-speed and more compact in size. Advantest provides carrying and contacting mechanism components compatible with each device under test for test handlers for memory semiconductors and test handlers for non memory semiconductors.
Services, Support and Others Segment
In the services, support and others segment, Advantest has focused on maintenance serv! ices, suc! h as installation and repair of Advantest�� products. It also focused on lease and rental services of its products as a part of Advantest�� effort to provide customers with comprehensive solutions.
The Company competes with Teradyne, Inc., Verigy Ltd., LTX-Credence Corporation, Yokogawa Electronic Corporation, FROM30 CO., LTD., EXICON Ltd., UniTest Inc., Delta Design, Inc., Seiko Epson Corporation, Mirae Corporation, TechWing, Inc., TSE Co., Ltd. and Secron Co., Ltd.
Advisors' Opinion: - [By Dan Carroll]
Nissan's done better this year than electronics maker Advantest (NYSE: ATE ) , but this stock absolutely blew up over the past week. Advantest's shares shot higher by more than 9%, wiping out pessimism over the company's weak earnings released a few weeks ago. Advantest's net loss and operating profit both fell below its guidance, and despite this week's investor optimism, the future's murky for this company. Financial site TheStreet downgraded the stock last week, citing Advantest's falling earnings, among other issues.
Hot Semiconductor Stocks To Own Right Now: China Electronics Corporation Holdings Co Ltd (0085.HK)
China Electronics Corporation Holdings Company Limited is an investment holding company. The Company, through its subsidiaries, is engaged in design, research and development and sale of integrated circuits. The Company�� integrated circuits design business consists of the design of integrated circuits chips and the development of application system. Its products are used in smart cards, such as identity cards, social security cards, telecommunications cards and electric cards. Its products are also applied in wireless local area networks (WLAN). During the year ended December 31, 2011, the Company obtained 17 new patents, and registered another 16 computer software copyrights and 11 integrated circuits layout designs. Its subsidiaries include CEC Integrated Circuit (Beijing) Co., Ltd, CEC Huada Electronic Design Co., Ltd and others.
Hot Semiconductor Stocks To Own Right Now: NVIDIA Corp (NVD)
NVIDIA Corporation (NVIDIA), incorporated on February 24, 1998, is engaged in creating the graphics chips used in personal computers (PCs). The Company operates in three segments: graphics processing unit (GPU) Business, professional solutions business (PSB) and consumer products business (CPB). Its mobile processors are used in cell phones, tablets and auto infotainment systems. Designers use GPUs to create visual effects in movies and create everything from golf clubs to jumbo jets. NVIDIA solutions are based on two technologies: the GPU and the mobile processor. GPUs are the engines of visual computing, the science and art of using computers to understand, create and enhance images. It has three GPU product brands: GeForce, which creates visual experiences for gamers; Quadro, which is engaged in visual computing for designers and digital artists, and Tesla, which accelerates applications for scientists and researchers. Tegra is its mobile processor and is built for applications ranging from smartphones, tablets and notebook PCs to televisions and cars. During the fiscal year ended January 29, 2012 (fiscal 2012), it acquired Icera Inc.In fiscal 2012, it launched Project Maximus, which uses the compute power of Tesla with the visualization power of Quadro to merge the design and simulation stages into one workstation. In May 2012, the Company and Intellectual Ventures announced that they jointly acquired a set of patents developed and owned by IPWireless. The portfolio comprises approximately 500 patents granted and pending in the wireless communications area, including concepts in LTE, LTE-Advanced and 3G/4G technologies.
GPU Business
The Company�� GPU business revenue includes primarily sales of its GeForce discrete and chipset products that support desktop and notebook PCs plus license fees from Intel and sales of memory products. It also accelerates video editing and high definition (HD), content creation by consumers. GeForce GPUs power PCs made by or distributed by ! PC original equipment manufacturers (OEMs), in the world. Its media and communications processor (MCP) chipsets primarily comprised of its ION motherboard GPUs, a product reaching the end of its life cycle.
Professional Solutions Business
The Company�� PSB consists of its Quadro professional workstation products and its Tesla computing products. Its Quadro products are designed to deliver the graphics performance and application compatibility for professionals. Tesla applies the processing power of its GPUs to general-purpose computing problems. Quadro products add functionality, such as photorealistic rendering, to computer-aided design workstations, and are used in professional video editing applications and for generating special effects in movies. Tesla is used in supercomputing centers and in oil exploration; other applications include accelerating drug discovery, weather simulations and derivative price modeling.
Consumer Products Business
The Company�� CPB includes its Tegra system-on-chip products for smartphones, tablets, automotive infotainment systems, and other similar devices, and Icera baseband processors. The Tegra revenues are generated by sales in smart phones and tablets. CPB also includes license, royalty, other revenue and associated costs related to video game consoles and other digital consumer electronics devices. NVIDIA Tegra mobile products implement design techniques, both inside the chips and at the system level. These technologies enhance visual display capabilities, connectivity and minimize chip and system-level power consumption. During fiscal 2012, it launched Tegra 3, quad-core mobile computing chip, bringing PC levels of performance within the power envelope of a cellular phone chip. It also launched DirectTouch.
The Company competes with Advanced Micro Devices (AMD), Intel, Matrox Electronics Systems Ltd., VIA Technologies, Inc., ARM Holdings plc, Broadcom Corporation, Freescale Semiconductor Inc., ! Fujitsu L! imited, Imagination Technologies Ltd., Intel, Marvell Technology Group Ltd., NEC Corporation, Qualcomm Incorporated, Renesas Technology Corp., Samsung Electronics Co. Ltd., Seiko Epson Corporation, ST-Ericsson, Texas Instruments Incorporated, Toshiba America Electronic Components, Inc., Imagination Technologies Group plc., HiSilicon Technologies Co., Ltd., Mediatek, Qualcomm Incorporated, Spreadtrum Communications Co., Ltd and ST-Ericsson.
Hot Semiconductor Stocks To Own Right Now: NVIDIA Corp (NVDA.F)
NVIDIA Corporation (NVIDIA), incorporated on February 24, 1998, is engaged in creating the graphics chips used in personal computers (PCs). The Company operates in three segments: graphics processing unit (GPU) Business, professional solutions business (PSB) and consumer products business (CPB). Its mobile processors are used in cell phones, tablets and auto infotainment systems. Designers use GPUs to create visual effects in movies and create everything from golf clubs to jumbo jets. NVIDIA solutions are based on two technologies: the GPU and the mobile processor. GPUs are the engines of visual computing, the science and art of using computers to understand, create and enhance images. It has three GPU product brands: GeForce, which creates visual experiences for gamers; Quadro, which is engaged in visual computing for designers and digital artists, and Tesla, which accelerates applications for scientists and researchers. Tegra is its mobile processor and is built for a pplications ranging from smartphones, tablets and notebook PCs to televisions and cars. During the fiscal year ended January 29, 2012 (fiscal 2012), it acquired Icera Inc.In fiscal 2012, it launched Project Maximus, which uses the compute power of Tesla with the visualization power of Quadro to merge the design and simulation stages into one workstation. In May 2012, the Company and Intellectual Ventures announced that they jointly acquired a set of patents developed and owned by IPWireless. The portfolio comprises approximately 500 patents granted and pending in the wireless communications area, including concepts in LTE, LTE-Advanced and 3G/4G technologies.
GPU Business
The Company�� GPU business revenue includes primarily sales of its GeForce discrete and chipset products that support desktop and notebook PCs plus license fees from Intel and sales of memory products. It also accelerates video editing and high definition (HD), content creation by consumers. GeForce GPUs power PCs made by or distributed! ! by PC original equipment manufacturers (OEMs), in the world. Its media and communications processor (MCP) chipsets primarily comprised of its ION motherboard GPUs, a product reaching the end of its life cycle.
Professional Solutions Business
The Company�� PSB consists of its Quadro professional workstation products and its Tesla computing products. Its Quadro products are designed to deliver the graphics performance and application compatibility for professionals. Tesla applies the processing power of its GPUs to general-purpose computing problems. Quadro products add functionality, such as photorealistic rendering, to computer-aided design workstations, and are used in professional video editing applications and for generating special effects in movies. Tesla is used in supercomputing centers and in oil exploration; other applications include accelerating drug discovery, weather simulations and derivative price modeling.
Consumer P roducts Business
The Company�� CPB includes its Tegra system-on-chip products for smartphones, tablets, automotive infotainment systems, and other similar devices, and Icera baseband processors. The Tegra revenues are generated by sales in smart phones and tablets. CPB also includes license, royalty, other revenue and associated costs related to video game consoles and other digital consumer electronics devices. NVIDIA Tegra mobile products implement design techniques, both inside the chips and at the system level. These technologies enhance visual display capabilities, connectivity and minimize chip and system-level power consumption. During fiscal 2012, it launched Tegra 3, quad-core mobile computing chip, bringing PC levels of performance within the power envelope of a cellular phone chip. It also launched DirectTouch.
The Company competes with Advanced Micro Devices (AMD), Intel, Matrox Electronics Systems Ltd., VIA Technologies, Inc., ARM Hol dings plc, Broadcom Corporation, Freescale Semiconducto! r Inc! .,! Fujits! u Limited, Imagination Technologies Ltd., Intel, Marvell Technology Group Ltd., NEC Corporation, Qualcomm Incorporated, Renesas Technology Corp., Samsung Electronics Co. Ltd., Seiko Epson Corporation, ST-Ericsson, Texas Instruments Incorporated, Toshiba America Electronic Components, Inc., Imagination Technologies Group plc., HiSilicon Technologies Co., Ltd., Mediatek, Qualcomm Incorporated, Spreadtrum Communications Co., Ltd and ST-Ericsson.
Hot Semiconductor Stocks To Own Right Now: NVIDIA Corporation(NVDA)
NVIDIA Corporation provides visual computing, high performance computing, and mobile computing solutions that generate interactive graphics on various devices ranging from tablets and smart phones to notebooks and workstations. It operates in three segments: Graphic Processing Unit (GPU), Professional Solutions Business (PSB), and Consumer Products Business (CPB). The GPU segment offers GeForce discrete and chipset products, which support desktop and notebook personal computers plus memory products. The PSB segment provides its Quadro professional workstation products and other professional graphics products, including its NVIDIA Tesla high-performance computing products used in the manufacturing, entertainment, medical, science, and aerospace industries. The CPB segment offers Tegra mobile products, which support tablets, smartphones, personal media players, Internet television, automotive navigation, and other similar devices. This segment also licenses video game consol es and other digital consumer electronics devices. The company sells its products to original equipment manufacturers, original design manufacturers, add-in-card manufacturers, consumer electronics companies, and system builders worldwide that utilize its processors as a core component of their entertainment, business, and professional solutions. NVIDIA Corporation was founded in 1993 and is headquartered in Santa Clara, California.
Advisors' Opinion: - [By Evan Niu, CFA]
Graphics specialist and mobile chip maker NVIDIA (NASDAQ: NVDA ) intends to return $1 billion of capital to investors this fiscal year, the company announced today.
- [By Sean Williams]
Graphics chip and mobile processor producer NVIDIA (NASDAQ: NVDA ) went the other way with its third-quarter results, missing sales expectations, and guiding revenue lower than the Street anticipated in the fourth quarter. It still managed, however, to vault higher by 7% on the day after raising its dividend by 13%, and topping EPS expectations in the third quarter. For the quarter, NVIDIA delivered adjusted EPS of $0.26, which topped expectations by $0.07, even with the aforementioned revenue miss. NVIDIA also announced a plan to return $1 billion in share buybacks and dividends to shareholders in 2015, and approved an additional $1 billion in share repurchases. Although revenue is expected to be flat quarter over quarter, I'm quite optimistic that the company's Tegra chips will be a big success in mobile, and would suggest NVIDIA remain a company you keep high on your watchlist
- [By Evan Niu, CFA]
The first half of 2013 has been relatively slow for�NVIDIA� (NASDAQ: NVDA ) , with shares mostly keeping pace with the broader market. This is expected, as the company made the conscious decision to delay the Tegra 4 time frame in order to focus on Tegra 4i. The graphics business continues to hold up admirably in the face of a slow PC market, as NVIDIA's target gamer market remains resilient.
Hot Semiconductor Stocks To Own Right Now: Analog Devices Inc (ADI)
Analog Devices, Inc. (Analog Devices), incorporated on January 18, 1965, is engaged in the design, manufacture and marketing of a range of analog, mixed-signal and digital signal processing integrated circuits (ICs). The Company produces a range of products, including data converters, amplifiers and linear products, radio frequency (RF) ICs, power management products, sensors based on micro-electro mechanical systems (MEMS) technology and other sensors, and processing products, including DSP and other processors, which are designed to meet the needs of a base of customers. The Company's products are embedded inside many different types of electronic equipment, including industrial process control systems; instrumentation and measurement systems; wireless infrastructure equipment, and aerospace and defense electronics. The Company designs , manufactures and markets a range of ICs, which incorporate analog, mixed-signal and digital signal processing technologies. The Company's product portfolio includes both general-purpose products used by a range of customers and applications, as well as application-specific products. On March 30, 2012, the Company acquired Multigig, Inc.
Analog Products
The Company's product portfolio includes several thousand analog ICs. The Company's analog IC customers include original equipment manufacturers (OEMs) and customers who build electronic subsystems for integration into larger systems. The Company is a supplier of data converter products. Data converters translate real-world analog signals into digital data and also translate digital data into analog signals. The Company is also a supplier of amplifiers. Amplifiers are used to condition analog signals. The Company provides precision, instrumentation, intermediate frequency/radio frequency (RF), broadband, and other amplifiers. The Company also offers a range of precision voltage references, which are used in a range of applications. The Company's analog product line also includes a range port! folio of RF ICs covering the RF signal chain, from RF function blocks, such as phase locked loops, frequency synthesizers, mixers, modulators, demodulators, and power detectors, to broadband and short-range single chip transceiver solutions.
The Company's RF ICs support the requirements of cellular infrastructure and a range of applications in the Company's target markets. Also within the Company's analog technology portfolio are products, which are based on MEMS technology. This technology enables the Company to build small sensors, which incorporate an electromechanical structure and the supporting analog circuitry for conditioning signals obtained from the sensing element. The Company's MEMS product portfolio includes accelerometers used to sense acceleration, gyroscopes used to sense rotation, inertial measurement units used to sense multiple degrees of freedom combining multiple sensing types along multiple axis, and MEMS microphones used to sense audio. The Company's current revenue from MEMS products is derived from the automotive end market. In addition to the Company's MEMS products, its other analog product category includes isolators. The Company's isolators have been designed for applications, such as universal serial bus isolation in patient monitors, where it allows hospitals and physicians to adopt the advances in computer technology to supervise patient health and wirelessly transmit medical records. In smart metering applications, the Company's isolators provide electrostatic discharge performance. In satellites, where any malfunction can be catastrophic, the Company's isolators help protect the power system while enabling designers to achieve small form factors. Power management & reference products make up the balance of the Company's analog sales. Those products, which include functions such as power conversion, driver monitoring, sequencing and energy management, are developed to complement analog signal chain components across core market segments from micro power, en! ergy-sens! itive battery applications to power systems in infrastructure and industrial applications.
Digital Signal Processing Products
Digital Signal Processing products (DSPs) complete the Company's product portfolio. DSPs are optimized for numeric calculations, which are essential for instantaneous, or real-time, processing of digital data generated, from analog to digital signal conversion. The Company's DSPs are designed to be fully programmable and to execute specialized software programs, or algorithms, associated with processing digitized real-time, real-world data. Programmable DSPs are designed to provide the flexibility to modify the device's function using software. The Company's DSP IC customers write their own algorithms using software development tools provided by the Company and third-party suppliers. The Company's DSPs are designed in families of products, which share common architectures and therefore can execute the same software across a range of products. The Company's customers use the Company's products to solve a range of signal processing challenges across its core market and segment focus areas within the industrial, automotive, consumer and communications end markets. As an integrated part of the Company's customers' signal chain, there are other Analog Devices products connected to its processors, including converters, audio and video codecs and power management solutions.
The Company competes with Broadcom Corporation, Maxim Integrated Products, Inc., Cirrus Logic, Inc., Microchip Technology, Inc., Freescale Semiconductor, Inc., NXP Semiconductors, Infineon Technologies, ST Microelectronics, Intersil Corporation, Silicon Laboratories, Inc., Knowles Electronics, Texas Instruments, Inc. and Linear Technology Corporation.
Advisors' Opinion: - [By Rich Smith]
Analog Devices (NASDAQ: ADI ) has a new boss.
On Monday, Analog announced it has confirmed 25-year company veteran and current interim Chief Executive Officer Vincent Roche as its new CEO.
- [By Laura Brodbeck]
Earnings Expected: From�Barnes & Noble, Inc. (NYSE: BKS), DSW Inc. (NYSE: DSW), Tiffany & Co., Hormel Foods Corporation (NYSE: HRL), TiVo Inc., Analog Devices, Inc. (NASDAQ: ADI), Hewlett-Packard Company.